Zincobrite SZ75 is an acid zinc sulphate system designed for the plating of steel wire and reel to reel
Soldertec 9010 is a bright tin-lead plating process for barrel and rack applications utilizing a Methane Sulfonic Acid electrolyte.
Soldertec 200 is a sulphonic acid based bright tin plating process, suitable for technical and decorative applications.
Soldertec 100 is a sulphate based bright tin plating process, suitable for technical and decorative
StanCo TNG is a tin/cobalt alloy process for decorative and functional applications designed as an alternative to chrome.
The Nibrite 60K process has been developed to produce a high sulphur deposit giving increased corrosion resistance in multi-layer nickel plating.
RS78 Pyrophosphate Copper produces bright copper deposits.
Ni-star MP (CLAF) is a state of the art cadmium, lead and ammonia free medium phophorus electroless nickel-plating process.
Cubrite HT250 Acid Copper plating process is a non-dye, high throw system designed for both decorative and functional applications.
An effective post-rinse for parts plated in acid tin processes e.g.Tin Plate SA and Stannotek.
Concentrated brightener which produces a mirror bright finish over a wide current
Acid zinc with a hyper concentrated additive system producing bright, highly levelled deposits. It shows superior brightness from high current density to low.
Designed to enable tap water to be used in alkaline zinc plating processes.
Single additive, sulphuric acid based bright tin plating process, suitable for technical and decorative applications. Tin Plate SA can be used for rack and barrel plating.
Sulphuric acid based bright tin plating process, suitable for technical and decorative applications. Stanos can be used for rack and barrel plating.
Highly effective, economical, soak/electrolytic cleaner which will rapidly remove soils from many types of surface without attack on the base metal.
Tin/nickel alloy plating has exceptional corrosion resistance and a superb finish. The deposit contains 65% tin: 35% nickel, a composition which is exceptionally consistent within the operating parameters.
Electroless nickel process developed specifically for plating on magnesium die-castings.
A state of the art cadmium and ammonia free electroless nickel-plating process,
designed to deposit a uniform, bright nickel – phosphorus deposit.
A Spray Suppressant, specifically developed to reduce surface tension and spray in chrome plating and pickling baths.
One of a series of decorative gold plating processes specially formulated to give a nickel alloyed gold with consistent pale gold coloured deposit.
Decorative chromium plating process based on trivalent chromium complexes. It is a substitute for traditional hexavelent chromium plating processes.
High speed decorative chromium plating process. Decochrome Catalyst is supplied as a liquid which is added to chromic acid solution.
High speed acid gold plating process specially formulated for use in reel-to-reel plating machines or automatic high speed plating of printed circuit board edge contacts
Brass Plating Process.
Alkali Cyanide Free Zinc Process providing excellent throwing power and distribution.
Highly concentrated Cyanide Zinc process offering excellent uniform brightness across a range of current densities.
Highly Concentrated Acid Zinc Process, providing superior brightness with low addition rates.
Developed to produce a semi-bright, highly levelled, ductile nickel deposit, ideal for duplex systems.
ASA 60 is a spray supppressant that has been specifically developed to reduce surface tension and spray in
Cyanide based bright Cadmium Process.
Acid Based with High Temperature resistant for rack and barrel applications.
Chemical Black room temperature chemical blackening process giving a deep, uniform black colour.
Alloy offering an alternative to Chrome exhibiting a white – light Decorative Chrome like finish.
General purpose wetting – anti-pitting agent for use with Nickel plating baths.
Highly levelled, high throw fully bright Nickel process, recommended for the most demanding of applications
Medium Phosphorous Cadmium and Ammonia free EN. Excellent deposit qualities combined with good solution stability and high MTO
Flouride free Catalyst system providing excellent plating rates at low concentrations.
CuBrite 210 is a hardened Acid Copper used for the production of printing dyes and rollers for the Rotogravure industry.
Fully bright Acid Copper giving excellent levelling, brightening and throwing properties, used for the most challenging of applications.
Alkaline process containing no complexants. Suitable for rack and barrel producing bright deposits.
Single additive pure Tin Sulphate or MSA based process exhibiting a fine grained matt deposit.
Tri-Alloy Decorative Finish, specifically used for decorative applications.
Gold Potassium Cyanide. Available in 25, 50 or 100gm units.
Replenishable immersion Gold used in Electroless Nickel Immersion Gold Applications (ENIG).
General purpose Gold strike.
Pure Gold for bonding and other applications.
Nickel Hardened Electrolytic Gold.
Decorative Immmersion Gold Process.
Colour Gold processes for heavy Gold plating available in all colour.
Range of alkaline gilding solutions formulated for ease of control and colour consistency.
Sulphuric acid based bright tin plating process, suitable for functional and decorative applications.
High purity technical grade Chromic acid.
PVC based lacquer for both acid and alkali resistance.
DHC reduces surface tension and spray in pickle and plating applications.
Neutralising Salts for Chromic Rinse Waters. Reduces Chrome in rinse waters to trivalent state.
Corrosion resistant non reflective Black Chrome process.
High throw flouride free catalysed process.
Silver Cyanide 80.5% available in various pack sizes.
54.2% Silver Potassium Cyanide available in various pack sizes.
Clear solution giving fully bright deposits suitable for both rack and barrel applications.
High purity, fully bright deposit, suitable for electronic and decorative applications.
High throw, high levelling Acid Copper.
Full Bright Acid copper exhibiting a fine grained ductile deposit.
Alkaline non cyanide Copper Process.
A highly leveled fully Bright Acid Copper. A dye based system with superior throwing power.Ideally suited for decorative processes.
A highly stable additive system designed to give a bright finish reducing the required thickness of subsequent coatings.
High efficiency Cyanide based Copper process.
Low additive, high Sulphur based Electrolytic Nickel used as part of a Duplex or Tri Nickel System.
Highly stable system giving uniform fine grained deposit.
Used as a low stress undercoat for Gold, Palladium and other metals.
Low temperature auto-catalytic process for ABS based materials.
Fully bright highly stable medium phosphorus process, Lead and Cadmium free.
Strike solution used for Aluminium, extending the life of your main electroless Nickel bath.
High Phosphorus EN giving excellent stability deposit qualities.
Medium Phosphorus bright EN, excellent stability and extended MTO properties
Zincalloy ZNI is a new generation of high-efficiency alkaline zinc nickel processes giving an alloy of 12-15% nickel.
An alkaline zinc-iron alloy plating process giving exceptional corrosion resistance.
Solvent based additive system producing mirror bright deposits.
High temperature stability and high contamination resistance additive system with outstanding brightness.
Water based Acid Zinc process.