Tin/nickel alloy plating has exceptional corrosion resistance and a superb finish. The deposit contains 65% tin: 35% nickel, a composition which is exceptionally consistent within the operating parameters.
Developed to produce a semi-bright, highly levelled, ductile nickel deposit, ideal for duplex systems.
General purpose wetting – anti-pitting agent for use with Nickel plating baths.
Highly levelled, high throw fully bright Nickel process, recommended for the most demanding of applications
Low additive, high Sulphur based Electrolytic Nickel used as part of a Duplex or Tri Nickel System.
Highly stable system giving uniform fine grained deposit.
Used as a low stress undercoat for Gold, Palladium and other metals.