Standard concentration Acid Etchant regeneration additive.
Super roughness liquid Copper Microetch for surface preparation prior to Solder Mask.
Suphuric-Peroxide cleaner etch system for use prior to dry film lamination, ideal for automated copper control systems.
Persulphate Microetch containing etch catalyst.
Used with our Etch Pro Acid Etch controller, hyper concentrated re oxidiser.
Liquid version of above – supplied as a concentrate makes it ideal for bleed and feed applications.
A bended powder Microetch containing acid salts for ease of use.
Versatile powdered persulphate microetch.