Procirc 9624 DM Accelerator is used after the Procirc 9622 DM Activator to improve the adhesion and
coverage of copper plating.
Procirc 9623 EC Accelerator is used after the Procirc 9620 EC Activator.
Procirc 9622 DM Activator is a colloidal palladium catalyst.
AProcirc 9620L Pre-Dip is designed to maintain the salt concentration of palladium based activators
Procric 9620 and 9622 by preventing excess water drag in.
Procirc 9620 EC Activator is a colloidal palladium catalyst.
PROCIRC 9005 Hole Conditioner has been specifically developed to clean copper and condition
dielectric surfaces prior to metallisation or graphite deposition in through hole plating processes.
Stabilised Neutraliser used following Permanganate treatment.
Potassium based process for etch back and smear removal.
Sweller to remove drill smear from the hole wall.
Three-step process for use in flood conveyorised modules.
EDTA based ultra fine grained highly stable EC system.
Highly stable two component low build EC system.