Nickel hardened Gold used for edge connectors and full pattern plating.
Formulated to deposit a thin, virtually pore free layer of Tin on Copper.
Fine grained immersion deposit with Copper corrosion protective properties.
Organic Solderable Preservative (OSP) Advanced technology multi-solderable system for use as a final finish, full process line chemistry.
Easy to use immersion system giving a consistent flat, dense, solderable Gold finish for surface mount devices.
Pure Gold for bonding and other applications.