CIRGOLD 965

IMMERSION GOLD

Cirgold 965 Immersion Gold has been formulated to non-electrolytically deposit a dense, even coating of
pure gold on electroless nickel substrates. The process has been specially developed as the final stage
of PMD (UK) Limited’s Cirgold SMD electroless nickel and gold solderable finish for printed circuit
boards.
When used in conjunction with Procirc 964 Electroless Nickel a flat, even, solderable finish is produced
which is ideal for surface mount devices.
A deposit thickness of up to 0.15 microns can be obtained depending upon operating conditions.

Download: TDS

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