Procirc 963PD Pre-dip has been formulated as an integral part of the Cirgold SMD system for electroless
nickel and immersion gold plating of printed circuit boards for surface mount devices. Procirc 963PD is
used prior to the palladium activator to condition copper surfaces before the activator. The use of 963PD
Pre-dip ensures complete and uniform palladium coverage.

Download: TDS

If you require an MSDS download then please submit anĀ enquiry form