Procirc 9701 LB

Low Build Electroless Copper Process

A low build Electroless Copper system depositing up to 0.6 microns of fine grained dense copper on the hole wall to establish initial through hole conductivity. This 6 step process is extremely easy to use and control with minimum analysis required. The highly concentrated additives ensure a cost effective and reliable process generating minimal waste.

Highly stable two component low build EC system.

Downloads: TDS

If you require an MSDS download then please submit an enquiry form.