Procirc 9701 LB
Low Build Electroless Copper Process
A low build Electroless Copper system depositing up to 0.6 microns of fine grained dense copper on the hole wall to establish initial through hole conductivity. This 6 step process is extremely easy to use and control with minimum analysis required. The highly concentrated additives ensure a cost effective and reliable process generating minimal waste.
Highly stable two component low build EC system.
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