Cirgold 965 Immersion Gold has been formulated to non-electrolytically deposit a dense, even coating of pure gold on electroless nickel substrates. The process has been specially developed as the final stage of PMD (UK) Limited’s Cirgold SMD electroless nickel and gold solderable finish for printed circuit boards.
When used in conjunction with Procirc 964 Electroless Nickel a flat, even, solderable finish is produced which is ideal for surface mount devices.
A deposit thickness of up to 0.15 microns can be obtained depending upon operating conditions.
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