Electrolytic Pure Gold. This high purity gold deposits 1 micron in less than 4 minutes operating at O.5amps/sqdm. used where bonding and solderability techniques are used.
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PMD Cirgold PG900 is a pure gold plating process specially formulated to produce deposits with optimum bonding, heat resistant and corrosion resistant properties.
Cirgold N92 is a high speed acid gold plating process specially formulated for use in reel-toreel plating machines or automatic high speed plating of printed circuit board plating.
Cirgold TS204 is an acidic gold process for the direct plating of stainless steel as well as an undercoat for cyanide gold plating or other electrolytes that require a pre-gold layer to promote adhesion. The gold deposit is ductile with low porosity and can also be used as a decorative finish.
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