The first stage of a three part system used for the smear removal and/or etch back of the hole wall prior to metalisation of multilayers. 9600 conditions the hole wall and ensures a clean surface for subsequent micro roughening in the De Smear step.
Sweller to remove drill smear from the hole wall.
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Permanganate based De Smear process designed to micro roughen the hole wall to ensure perfect adhesion of Electroless Copper or direct deposits on multilayer PCBs. 9605 contains additives that help to ‘wet’ the hole wall to ensure hole diameters of below 0.3mm are completely treated. Potassium based process for etch back and smear removal.
Neutralisation stage that forms the third stage of our De Smear process. 9606 is a highly concentrated additive that stabilises the Neutraliser and ensures complete removal of Permanganate residues left after the micro roughening stage. 9606 prolongs the life of the process and exhibits excellent solution yields. Stabilised Neutraliser used following Permanganate treatment.
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