PROCIRC 9802

Procirc 963 Activator has been formulated as an integral part of the Cirgold SMD system for electroless nickel and immersion gold plating of printed circuit boards for surface mount devices. Procirc 963 Activator is a palladium based material for activating copper surfaces before electroless nickel plating. its use ensures complete and uniform nickel coverage.

Organic Solderable Preservative (OSP) Advanced technology multi-solderable system for use as a final finish, full process line chemistry.

Electroless Nickel immersion Gold process for use as a final finish for PCB’s. PROCIRC SMT 96 is a six step system resulting in a fine grain, pore free multi solderable gold deposit. Our Palladium catalyst deposits a uniform thin metallic layer ideal for subsequent deposition of electroless Nickel. PROCIRC 964 Electro less Nickel is a two component highly stable EN which easy to control and ensures correct deposition thickness and complete coverage. Easy to use immersion system giving a consistent flat, dense, solderable Gold finish for surface mount devices. Replenishable solution operates at low Gold concentration giving economical processing. Advanced Nickel formulation for elimination of Black pad and skip plating.