Additive system for use in Sulphate or Methane Sulphonic Acid (MSA) based electrolytes used as an etch resist. 9834 ensures a fine grained, pore free deposit ideal for subsequent amoniacal etch resistance. 9834 does not attack dry film side walls resulting in no Tin creep’.
Single additive pure Tin Sulphate based process for use as an electroplated etch resist for ammoniacal etch resistance.
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