SOLDERTEC 200

Soldertec 6040 is a bright tin-lead plating process for rack and barrel applications utilizing a Methane Sulfonic Acid electrolyte. Deposits exhibit a very high degree of brilliance and show good conductivity and solderability even after accelerated heat ageing. Soldertec 6040 operates over a wide CD range for increased output and flexibility in production. It also exhibits good throwing power and distribution characteristics.

Soldertec 9010 is a bright tin-lead plating process for barrel and rack applications utilizing a Methane Sulfonic Acid electrolyte. Deposits exhibit a very high degree of brilliance and show good conductivity and solderability. Soldertec 9010 operates over a wide CD range for increased output and flexibility in production. It also exhibits good throwing power and distribution characteristics.

Soldertec 100 is a sulphate based bright tin plating process, suitable for technical and decorative applications. Soldertec 100 can be used for rack and barrel plating of connectors and other related components.