PROCIRC 9623

Procirc 9624 DM Accelerator is used after the Procirc 9622 DM Activator to improve the adhesion and coverage of copper plating.

A low build Electroless Copper system depositing up to 0.6 microns of fine grained dense copper on the hole wall to establish initial through hole conductivity. This 6 step process is extremely easy to use and control with minimum analysis required. The highly concentrated additives ensure a cost effective and reliable process generating minimal waste. Highly stable two component low build EC system.

A medium-high build EDTA based Electroless Copper. The extremely fine grained, dense deposit means that thinner deposits can be made without effecting the resistance to microetching, this results in lower operating cost and reduced process cycle times. Procirc 9702 HB is extremely stable and operates in this way over a wide range of bath loadings, analysis is quick and simple making it an ideal process for medium to high volume production. EDTA based ultra fine grained highly stable EC system.