Procirc 9624 DM Accelerator is used after the Procirc 9622 DM Activator to improve the adhesion and coverage of copper plating.
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Procirc 9622 DM Activator is a colloidal palladium catalyst. It gives full coverage of dielectric to enable direct copper or nickel plating.
Procirc 9623 EC Accelerator is used after the Procirc 9620 EC Activator. It gives faster initiation of elecroless copper plating and improved adhesion.
A medium-high build EDTA based Electroless Copper. The extremely fine grained, dense deposit means that thinner deposits can be made without effecting the resistance to microetching, this results in lower operating cost and reduced process cycle times. Procirc 9702 HB is extremely stable and operates in this way over a wide range of bath loadings, analysis is quick and simple making it an ideal process for medium to high volume production. EDTA based ultra fine grained highly stable EC system.
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