High throw, three additive system next generation Acid Copper. 9725 gives excellent deposit distribution and complete leveling.
To inquire about this product or to request the MSDS, please reach out to us.
Procirc 6900 Acid Copper Plating Process produces excellent levelling and throwing power. It is formulated to cope with most types of printed circuit board plating.
If you have any technical queries or need pricing for this product, please let us know here.
This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.
Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.
This website uses Google Analytics to collect anonymous information such as the number of visitors to the site, and the most popular pages.
Keeping this cookie enabled helps us to improve our website.
More information about our Cookie Policy