PROCIRC CB6900

Procirc 9725 Acid Copper Plating Process is designed for high aspect ratio PCB production. The combination of a low organic additive system with high acid to copper ratio gives twice the throwing power of conventional baths.

CIRCUM-BRITE PPR-2000 is a form of pulse copper plating, it can provide a uniform fine copper distribution with excellent deposit ductility. CIRCUM-BRITE PPR-2000 can effectively reduce the plating time, as improve the uniformity of the deposit thickness on surface and the via wall. It is especially suitable for the use in high-aspect ratio PCB.

Cubrite HT255 Barrel Acid Copper Plating Process is a non-dye, high throw system designed for both decorative and functional applications. The three additive system ensures excellent throwing power and levelling properties.