Cubrite HT255 Barrel Acid Copper Plating Process is a non-dye, high throw system designed for both decorative and functional applications. The three additive system ensures excellent throwing power and levelling properties.
Cubrite HT250 Acid Copper Plating Process is a non-dye, high throw system designed for both decorative and functional applications. The three additive system ensures excellent throwing power and levelling properties.
Procirc 9725 Acid Copper Plating Process is designed for high aspect ratio PCB production. The combination of a low organic additive system with high acid to copper ratio gives twice the throwing power of conventional baths.