Cubrite HT250 Acid Copper Plating Process is a non-dye, high throw system designed for both decorative and functional applications. The three additive system ensures excellent throwing power and levelling properties.
Cubrite HT255 Barrel Acid Copper Plating Process is a non-dye, high throw system designed for both decorative and functional applications. The three additive system ensures excellent throwing power and levelling properties.
Procirc 6900 Acid Copper Plating Process produces excellent levelling and throwing power. It is formulated to cope with most types of printed circuit board plating.