Procirc 9725 Acid Copper Plating Process is designed for high aspect ratio PCB production. The combination of a low organic additive system with high acid to copper ratio gives twice the throwing power of conventional baths.
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CIRCUM-BRITE PPR-2000 is a form of pulse copper plating, it can provide a uniform fine copper distribution with excellent deposit ductility. CIRCUM-BRITE PPR-2000 can effectively reduce the plating time, as improve the uniformity of the deposit thickness on surface and the via wall. It is especially suitable for the use in high-aspect ratio PCB.
Cubrite HT250 Acid Copper Plating Process is a non-dye, high throw system designed for both decorative and functional applications. The three additive system ensures excellent throwing power and levelling properties.
Procirc 6900 Acid Copper Plating Process produces excellent levelling and throwing power. It is formulated to cope with most types of printed circuit board plating.
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