PROCIRC 9005 Hole Conditioner has been specifically developed to clean copper and condition dielectric surfaces prior to metallisation or graphite deposition in through hole plating processes.
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Procirc 9623 EC Accelerator is used after the Procirc 9620 EC Activator. It gives faster initiation of elecroless copper plating and improved adhesion.
Procirc 9624 DM Accelerator is used after the Procirc 9622 DM Activator to improve the adhesion and coverage of copper plating.
Three component horizontal carbon based direct metalisation system. Suited for flood conveyorised machinery providing an ultra fine particle carbon deposit to ensure complete cover of subsequent copper plating.
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